Semiconductor
As the integration level of integrated circuits continues to rise, the size of unit devices in circuits is constantly shrinking from millimeters to micrometers, and down to nanometers. Each unit device consists of a substrate, insulating layer, dielectric layer, conductor layer, and protective layer. Sputtering coating processes are required for the dielectric, conductor, and even protective layers. Therefore, sputtering targets are one of the core materials for manufacturing integrated circuits.
3
Capacitors
Resistors
Sensors
Integrated Circuits
As the integration level of integrated circuits continues to rise, the size of unit devices in circuits is constantly shrinking from millimeters to micrometers, and down to nanometers. Each unit device consists of a substrate, insulating layer, dielectric layer, conductor layer, and protective layer. Sputtering coating processes are required for the dielectric, conductor, and even protective layers. Therefore, sputtering targets are one of the core materials for manufacturing integrated circuits.
Capacitors
Resistors
Sensors
Integrated Circuits
As the integration level of integrated circuits continues to rise, the size of unit devices in circuits is constantly shrinking from millimeters to micrometers, and down to nanometers. Each unit device consists of a substrate, insulating layer, dielectric layer, conductor layer, and protective layer. Sputtering coating processes are required for the dielectric, conductor, and even protective layers. Therefore, sputtering targets are one of the core materials for manufacturing integrated circuits.
Capacitors
Resistors
Sensors
Integrated Circuits
Product
Nickel-vanadium target material
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