Magnetron Sputtering Coating Technology

Magnetron sputtering coating is a new type of physical vapor coating method. Compared with evaporation coating method, it has obvious advantages in many aspects. As a relatively mature technology that has been developed, magnetron sputtering has been applied in many fields.



Magnetron sputtering coatingis a new type of physical vapor coating method, which uses an electron gun system to emit and focus electrons on the plated material, so that the sputtered atoms follow the principle of momentum conversion and fly away from the material with higher kinetic energy. The substrate is deposited into a film. This plated material is calledsputtering target.sputtering targetare metals, alloys, ceramics, borides, etc.sputtering targetis mainly used in electronic and information industries, such as integrated circuits, information storage, liquid crystal display, laser memory, electronic control devices, etc. It can also be applied to the field of glass coating. It can also be applied to industries such as wear-resistant materials, high-temperature corrosion resistance, high-grade decorative products, etc. With the continuous progress of science and technology, display screens are used in more and more fields, such as communication facilities, home appliances, office supplies and other fields.

1. Classification of Magnetron Sputtering Targets

According to the composition of the material, the target material can be dividedmetal target,alloy target,inorganic nonmetallic target, etc. where inorganicnonmetallic targetcan be divided into different types of targets such as oxides, silicides, nitrides and fluorides. Depending on the geometry,targetcan be divided into long (positive) square-shaped targets, cylindrical targets and irregular-shaped targets. In addition,targetcan also be divided into solid and hollow targets.

At present, the most commonly used classification method for targets is based on target application fields, mainly including semiconductor application targets, recording medium application targets, display film application targets, optical targets, superconducting targets, etc. , targets for semiconductor fields, targets for recording media and display targets are the three types of targets with the largest market demand.

2. Application fields of magnetron sputtering targets

Magnetron sputtering targetare mainly used in electronic and information industries, such as integrated circuits, information storage, liquid crystal storage, liquid crystal displays, electronic control devices, etc., can also be used in the field of glass coating, can also be used in wear-resistant materials, high temperature corrosion resistance, chemical electroplating, metal foam materials, high-grade decorative products and other industries.

① Information storage industry

In the information storage industry, the usesputtering targetinclude hard disk, magnetic head, optical disk (CD-R,CD,DVD), magneto-optical phase change optical disk (MO,C-RW,DVD-KAM).

② IC industry

Integrated circuits account for a large share of the global target market. Its sputtering products mainly include electrode interconnect film, barrier film, contact film, disc mask, capacitor electrode film, resistance film, etc.

③ Flat panel display industry

Flat panel display includes: liquid crystal display (LCD), plasma display (PDP), electroluminescent display (E-L) and field emission display (PED). At present, liquid crystal display LCD has the largest market in the flat panel display market, with a share of up to 80%.

④ Optical Film Industry

Glass coating mainly include In2O3, SnO2, Co-Cr, Cu, Cr, Ni, Sn, etc. The main targets for automobile rear mirrors are: Cr, Al, SnO2, TiO2, etc.

3. Preparation method of magnetron sputtering target

Magnetron sputtering targetcan be divided into two categories according to the production process: melt casting method and powder metallurgy method. In the preparation process of the target material, in addition to strictly controlling the purity, density, grain size and crystallization orientation of the material, The heat treatment process conditions and subsequent molding process also need to be strictly controlled to ensure the quality of the target material.

① Melt casting method

Compared with powder metallurgy method, the target product produced by melt casting method has low impurity content and high density.

② Powder metallurgy

In general, melt casting cannot achieve refractorymetal sputtering target, for two or more metals with large difference in melting point and density, it is generally difficult to obtain alloy targets with uniform composition by ordinary melt casting method;

For inorganicnonmetallic target,composite target, melt casting is even more powerless, and powder metallurgy is the best way to solve the technical problems in preparing the above targets. At the same time, the powder metallurgy process also has the advantages of easy access to uniform fine grain structure, saving raw materials and high production efficiency.